Replacement coating for Hot Air Solder Leveling Process for SMOBC PC Boards. 

OMIKRON  white tin process is a single layer tin over copper, metal surface plated onto the copper base by means of an immersion process. This plating is applied only to the exposed pads and through holes after the circuitry has been covered with screened soldermask. 

OMIKRON WHITE tin is deposited in a thick (>40 microinches) layer directly over the exposed copper, and provides a diffusion barrier between the base copper and the tin surface. 

Some of the advantages of the OMIKRON tin replacement for HASL are : 
 
       Less expensive than HASL.  
              Lower energy and capital equipment costs offset slightly higher OMIKRON solution costs. 

       Avoids the thermal stresses of HASL.  
              Provides flat (no warp or twist) boards and extended rework times. 

       SurfaceMount Pads are flat. 
              Ideal for fine pitch surface mount as the solder paste application will be perfectly uniform. 

       No possibility of background plate on top of soldermask as with " planar process " 
              electroless nickel / gold. 

       Environmentally friendly.  
              No lead (Pb) process - reduces cost. 

Solderability and shelf life are excellent and has passed the following tests: 

Solderability via IPC ANSI/IPC-A-600D 
Solderability via IPC ANSI/IPC-A-610 
ANSI/J-STD-001B, STD-003 
Wetability via Trace Labs 
SIR and Electromigration via Bellcore TR-NWT-000078, Issue 3 
Metallic Dendritic Growth, IPC TM-650 

The International Tin Research Institute conducted extensive testing before and after aging under severe environmental conditions utilizing high temperatures and a 93% relative humidity. The OMIKRON white tin passed all tests.  Please feel free to contact us with any other questions you may have. 

*OMIKRON is a trademark of Florida Cirtech Inc.